PCB ASSEMBLY

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• Full cycle product design from the idea to the finished project
• Scope of supply of products after individual request (we have own stocks of electronic components)
• Possibility of urgent production and assembly of prototypes
• Urgent and mass production of printed circuit boards of any complexity, including flex-rigid and printed boards on a metal base
• High-performance automatic assembly of SMD elements in enclosures from 0201 to BGA, CSP and QFP chips with a small lead pitch
• Mounting of output elements using specialized equipment
• Quality assurance of products assembly using automatic optical inspection units of latest generation AOI
• X-ray inspection of the soldering quality of BGA chips with the reporting, including statistical, for the whole batch of printed units
• In addition, AER ELECTRONICS has a separate structural subdivision – the department of contract manufacture. The main task of the department is to provide the customer with the widest possible choice of high quality industrial services.

• from 1 piece to large batches 
• assembly of SMD-elements (from 0201), CSP and QFP chips with a small lead pitch 
• installation of BGA-components, Flip-Chip with a lead pitch up to 0.2 mm 
• installation of these chips on boards that already contain other elements 
• lead and lead-free soldering of components 
• dismantling of circuit boards in BGA enclosures 
• recovery of BGA pin connections (reballing) 
• X-ray inspection of soldering quality (with reporting) 
• semi-automatic and manual installation of DIP components 
• installation of flexible printed circuit boards 
• product testing and fine-tuning 
• climatic and mechanical tests 
• manufacture of metal and plastic details of enclosures 
• ISO9001 certified 

For more detailed information about the capabilities of the company, project evaluation and placement of applications for contract manufacturing, please contact us by e-mail: sales@aerelectronicsl.com